SO DDR5 16GB PC 4800 CL38 Kingston KIT (2x 8GB) FURY Impact retail content_copy

The Kingston FURY Impact DDR5 memory module, type KF548S38IBK2-16, is a memory kit for laptops and mini-desktop systems. It consists of two individual SO-DIMM modules, each with 8 GB memory capacity, resulting in a total capacity of 16 GB. The module is based on DDR5 technology and is designed for a memory data transfer rate of 4800 MT/s. The CAS latency is 38, ensuring fast responsiveness of the memory. The memory voltage is 1.1 V, enabling energy-efficient and reliable operation. The modules are equipped with a heatsink that reduces thermal stress during operation. The contact surfaces of the modules are gold-plated, ensuring a reliable electrical connection and high longevity. The modules comply with the JEDEC standard and are designed for use in systems with a 262-pin SO-DIMM socket.

Applications
This module is specifically developed for laptops and compact desktop systems requiring an SO-DIMM form factor. It is suitable for applications requiring high memory speed and stability, such as multitasking, gaming, creative applications, and professional software. Support for Intel® Extreme Memory Profile (XMP) 3.0 enables easy overclocking via the BIOS, optimizing system performance. The Plug-N-Play function ensures that the module automatically runs at the specified speed of 4800 MT/s without manual settings.

Features and Equipment in Detail
The module features On-Die ECC, an integrated error correction that enhances data integrity, especially during overclocking. It is unbuffered memory, which is standard for consumer systems. The memory rank is 1, allowing simple integration into systems with standard memory architecture. The modules are equipped with an SPD profile that supports automatic detection and configuration by the system. The programming supply voltage (VPP) is 1.8 V, required for controlling the memory cells.

Technology Explained Simply
DDR5 technology offers significantly higher data transfer rates and improved energy efficiency compared to DDR4. The memory data transfer rate of 4800 MT/s means that 4800 million data transfers are possible per second. The CAS latency of 38 indicates the number of clock cycles required to respond to a memory request. A low value such as 38 ensures faster access times. The memory voltage of 1.1 V is typical for DDR5 and reduces power consumption compared to older memory technologies. Support for XMP 3.0 enables targeted overclocking, with settings activated in the BIOS.

Compatibility and Accessories
The module is designed for systems supporting a 262-pin SO-DIMM socket. It is specifically designed for laptops and small desktop systems. Compatibility with Intel® XMP 3.0 allows the use of advanced memory profiles, which can be activated in the BIOS configuration. The modules are Plug-N-Play compatible, meaning they automatically run at the specified speed without manual BIOS settings.

Installation and Mounting
Installation is performed by inserting the two SO-DIMM modules into the corresponding memory slots of the laptop or mini-desktop. The modules are equipped with a 262-pin connector that fits into the socket. The gold-plated contacts ensure a secure connection. Mounting requires no additional tools, as the modules are secured in the socket by a clip mechanism. The operating temperature of the module ranges from 0 °C to 85 °C, while the storage temperature may range from -55 °C to 100 °C.

Advantages in Operation
The use of the Kingston FURY Impact DDR5 module provides improved system performance through high memory data transfer rate and low CAS latency. The On-Die ECC function increases the reliability of data transfer, especially under intensive use. The energy-efficient memory voltage of 1.1 V reduces power consumption and contributes to thermal stability. The Plug-N-Play function and support for XMP 3.0 enable simple and secure overclocking to maximize system performance. The modules are optimized for use in modern laptops and mini-desktop systems utilizing the latest memory technology.

Features
CAS latency	38
Internal memory	16 GB
Memory layout (modules x size)	2 x 8 GB
Internal memory type	DDR5
Memory data transfer rate	4800 MT/s
Component for	Laptop
Memory form factor	262-pin SO-DIMM
Buffered memory type	Unregistered (unbuffered)
Memory ranking	1
Memory voltage	1.1 V
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
Intel Extreme Memory Profile (XMP) version	3.0
Programming power voltage (VPP)	1.8 V
Cooling type	Heatsink
Lead plating	Gold
On-Die ECC
ECC
Intel Extreme Memory Profile (XMP)
SPD profile
JEDEC standard
Logistics data
Harmonized System (HS) code	84733020
Products per master (outer) case	25 pc(s)
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.37 kg
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Other features
Country of origin	China, Taiwan
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	46.21 g
Weight & dimensions
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	16 g

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