Features
Type	Thermal paste
Thermal conductivity	1.93 W/m·K
Product colour	Silver
Thermal resistance	0.12 °C/W
Specific gravity	1.7 g/cm³
Operating temperature (T-T)	-30 - 180 °C
Logistics data
Master (outer) case width	425 mm
Master (outer) case length	340 mm
Master (outer) case height	349 mm
Products per master (outer) case	230 pc(s)
Packaging data
Package width	148 mm
Package depth	81 mm
Package height	17 mm
Package weight	17 g
Technical details
Evaporation (@ 200°C/24h)	0.001%
Bleed (@ 200°C/24h)	0.05%
Compliance certificates	RoHS
Weight & dimensions
Width	20 mm
Depth	67 mm
Weight	4 g

Provide optimal heat transfer between CPU and heatsink through a metal oxide compound. This thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink.A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.