| Features |
| PCI Express configurations | x4, x8, x16 |
| Thermal Monitoring Technologies | Yes |
| CPU configuration (max) | 2 |
| Embedded options available | No |
| Idle States | Yes |
| Maximum number of PCI Express lanes | 40 |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX 2.0 |
| Thermal Design Power (TDP) | 145 W |
| Processor package size | 52.5 mm |
| Execute Disable Bit | Yes |
| Physical Address Extension (PAE) | 46 bit |
| Scalability | 2S |
| Memory |
| ECC supported by processor | Yes |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 1600,1866,2133 MHz |
| Memory bandwidth supported by processor (max) | 68 GB/s |
| Memory channels supported by processor | Quad |
| Power |
| VID Voltage Range | 0.65 - 1.3 V |
| Processor |
| Processor threads | 28 |
| Processor series | Intel Xeon E5-2600 v3 |
| Processor cores | 14 |
| Bus type | QPI |
| Box | Yes |
| Processor operating modes | 64-bit |
| Stepping | C1 |
| Processor codename | Haswell |
| Processor model | E5-2697V3 |
| Processor boost frequency | 3.6 GHz |
| Processor cache | 35 MB |
| FSB Parity | No |
| Processor socket | LGA 2011-v3 |
| Number of QPI links | 2 |
| Processor cache type | Smart Cache, L3 |
| Processor family | Intel Xeon E5 v3 |
| Component for | Server/Workstation |
| Processor frequency | 2.6 GHz |
| System bus rate | 9.6 GT/s |
| Processor lithography | 22 nm |
| Other features |
| Intel | VT-d,VT-x |
| Operational conditions |
| Tcase | 76.7 |
| Processor special features |
| Intel | Yes |
| Intel 64 | Yes |
| Intel TSX-NI | No |
| Intel Clear Video Technology | No |
| Intel Flex Memory Access | No |
| Intel Trusted Execution Technology | Yes |
| Intel TSX-NI version | 0.00 |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel Rapid Storage Technology | No |
| Conflict Free processor | No |
| Intel FDI Technology | No |
| Intel Fast Memory Access | No |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel Virtualization Technology for Directed I/O ( | Yes |
| Intel Secure Key Technology version | 1.00 |
| Intel Demand Based Switching | Yes |
| InTru? 3D Technology | No |
| Intel Dual Display Capable Technology | No |
| Intel Identity Protection Technology version | 0.00 |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
Device carriers made of galvanized, profiled sheet steel with a zinc coating combined with polyester resin paint ensure good corrosion protection. Tool-free fastening with design-integrated pressure locks ensure protection against theft and dismantling. Integrated plastic end faces with sealing lips and a circumferentially closed seal to the support rail for protection class up to IP64. Direct/indirect diffuse light distribution using Individual.Lens.Optic made of frosted plastic PMMA. The single lens optics contain a transparent seal, ensure high ease of installation and are easy to maintain thanks to the easy-to-clean surface. The rhythm of the 3-row single lens arrangement is perfectly coordinated within and across the device carrier and ensures a homogeneous appearance in the object. Electrical connection using a fixed 3-pin quick-assembly plug with free phase preselection. Integrated guide aid for quick contact.