| Features |
| Scalability | 2S |
| PCI Express configurations | x4, x8, x16 |
| Thermal Monitoring Technologies | Yes |
| CPU configuration (max) | 2 |
| Bandwidth | 6.4 MB/s |
| Processor package size | 52.5 mm |
| Embedded options available | No |
| Idle States | Yes |
| Maximum number of PCI Express lanes | 40 |
| Supported instruction sets | AVX 2.0 |
| PCI Express slots version | 3.0 |
| Thermal Design Power (TDP) | 85 W |
| Execute Disable Bit | Yes |
| Physical Address Extension (PAE) | 46 bit |
| Technical details |
| Bus bandwidth | 6.4 |
| Maximum memory | 768 GB |
| Launch date | 2014-09-08T00:00:00 |
| Bus type units | GT/s |
| Product name | Intel Xeon E5-2603 v3 (15M Cache, 1.60 GHz) |
| Processor core voltage | 0.65?1.30 |
| Processor cache | 15360 KB |
| Market segment | SRV |
| Born on date | Q3'14 |
| Processor brand name | Intel Xeon v2 |
| Product type | 4 |
| Status | 4 |
| Memory |
| ECC supported by processor | Yes |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 1600 MHz |
| Memory bandwidth supported by processor (max) | 51 GB/s |
| Memory channels supported by processor | Quad |
| Power |
| VID Voltage Range | 0.65 - 1.3 V |
| Processor |
| System bus rate | 6.4 GT/s |
| Processor lithography | 22 nm |
| Processor cores | 6 |
| Stepping | R2 |
| Processor threads | 6 |
| Processor socket | LGA 2011-v3 |
| Bus type | QPI |
| Box | Yes |
| Processor operating modes | 64-bit |
| Processor model | E5-2603V3 |
| Processor series | Intel Xeon E5-2600 v3 |
| Processor family | Intel Xeon E5 v3 |
| Number of QPI links | 2 |
| Processor cache | 15 MB |
| FSB Parity | No |
| Processor codename | Haswell |
| Processor frequency | 1.6 GHz |
| Processor cache type | Smart Cache, L3 |
| Component for | Server/Workstation |
| Other features |
| Intel | VT-d,VT-x |
| Cache memory | 15 MB |
| Maximum internal memory | 786432 MB |
| Operational conditions |
| Tcase | 72.8 |
| Processor special features |
| Intel | No |
| InTru? 3D Technology | No |
| Intel Virtualization Technology for Directed I/O ( | Yes |
| Intel FDI Technology | No |
| Intel Enhanced Halt State | Yes |
| Intel TSX-NI | No |
| Intel Identity Protection Technology version | 0.00 |
| Intel Flex Memory Access | No |
| Conflict Free processor | No |
| Intel TSX-NI version | 0.00 |
| Intel Trusted Execution Technology | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel 64 | Yes |
| Intel Fast Memory Access | No |
| Intel Secure Key Technology version | 1.00 |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel Demand Based Switching | Yes |
| Intel Rapid Storage Technology | No |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Clear Video Technology | No |
| Intel Dual Display Capable Technology | No |
Device carriers made of galvanized, profiled sheet steel with a zinc coating combined with polyester resin paint ensure good corrosion protection. Tool-free fastening with design-integrated pressure locks ensure protection against theft and dismantling. Integrated plastic end faces with sealing lips and a circumferentially closed seal to the support rail for protection class up to IP64. Direct/indirect diffuse light distribution using Individual.Lens.Optic made of frosted plastic PMMA. The single lens optics contain a transparent seal, ensure high ease of installation and are easy to maintain thanks to the easy-to-clean surface. The rhythm of the 3-row single lens arrangement is perfectly coordinated within and across the device carrier and ensures a homogeneous appearance in the object. Electrical connection using a fixed 3-pin quick-assembly plug with free phase preselection. Integrated guide aid for quick contact.