Features
PCI Express slots version	3.0
Thermal Monitoring Technologies	Yes
Scalability	2S
Embedded options available	No
Idle States	Yes
Physical Address Extension (PAE)	46 bit
CPU configuration (max)	2
PCI Express configurations	x4, x8, x16
Processor package size	52.5 mm
Maximum number of PCI Express lanes	40
Supported instruction sets	AVX 2.0
Thermal Design Power (TDP)	105 W
Execute Disable Bit	Yes
Technical details
Product name	Intel Xeon E5-2650 v3 (25M Cache, 2.30 GHz)
Processor brand name	Intel Xeon v2
Maximum memory	768 GB
Market segment	SRV
Bus bandwidth	9.6
Born on date	Q3'14
Product type	4
Bus type units	GT/s
Status	4
Processor core voltage	0.65?1.30
Launch date	2014-09-08T00:00:00
Processor cache	25600 KB
Memory
Memory channels supported by processor	Quad
ECC supported by processor	Yes
Maximum internal memory supported by processor	768 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	1600,1866,2133 MHz
Memory bandwidth supported by processor (max)	68 GB/s
Power
VID Voltage Range	0.65 - 1.3 V
Processor
Processor operating modes	64-bit
Processor model	E5-2650V3
Processor threads	20
Processor family	Intel Xeon E5 v3
Bus type	QPI
Box	No
FSB Parity	No
Stepping	M1
Processor frequency	2.3 GHz
Processor boost frequency	3 GHz
Processor cache	25 MB
L3 cache speed	2.3 GHz
Processor series	Intel Xeon E5-2600 v3
Component for	Server/Workstation
Number of QPI links	2
Processor cache type	Smart Cache, L3
Processor codename	Haswell
Processor lithography	22 nm
Processor cores	10
Processor socket	LGA 2011-v3
System bus rate	9.6 GT/s
Other features
Cache memory	25 MB
Maximum internal memory	786432 MB
Intel	VT-d,VT-x
Operational conditions
Tcase	78.9
Processor special features
Intel Rapid Storage Technology	No
Intel	2.0
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Clear Video Technology	No
Intel Dual Display Capable Technology	No
Intel Secure Key Technology version	1.00
InTru? 3D Technology	No
Intel Virtualization Technology for Directed I/O (	Yes
Conflict Free processor	No
Intel FDI Technology	No
Intel Enhanced Halt State	Yes
Intel Trusted Execution Technology	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel Identity Protection Technology version	0.00
Intel Flex Memory Access	No
Intel TSX-NI	No
Intel Virtualization Technology (VT-x)	Yes
Intel Demand Based Switching	Yes
Intel 64	Yes
Intel Fast Memory Access	No
Intel TSX-NI version	0.00
Graphics
On-board graphics adapter	No

Device carriers made of galvanized, profiled sheet steel with a zinc coating combined with polyester resin paint ensure good corrosion protection. Tool-free fastening with design-integrated pressure locks ensure protection against theft and dismantling. Integrated plastic end faces with sealing lips and a circumferentially closed seal to the support rail for protection class up to IP64. Direct/indirect diffuse light distribution using Individual.Lens.Optic made of frosted plastic PMMA. The single lens optics contain a transparent seal, ensure high ease of installation and are easy to maintain thanks to the easy-to-clean surface. The rhythm of the 3-row single lens arrangement is perfectly coordinated within and across the device carrier and ensures a homogeneous appearance in the object. Electrical connection using a fixed 3-pin quick-assembly plug with free phase preselection. Integrated guide aid for quick contact.