Features
PCI Express slots version	3.0
Thermal Monitoring Technologies	Yes
Scalability	2S
Embedded options available	Yes
Idle States	Yes
Physical Address Extension (PAE)	46 bit
CPU configuration (max)	2
PCI Express configurations	x4, x8, x16
Processor package size	52.5 mm
Maximum number of PCI Express lanes	40
Supported instruction sets	AVX 2.0
Thermal Design Power (TDP)	120 W
Execute Disable Bit	Yes
Technical details
Product name	Intel Xeon E5-2680 v3 (30M Cache, 2.50 GHz)
Processor brand name	Intel Xeon v2
Maximum memory	768 GB
Market segment	SRV
Bus bandwidth	9.6
Born on date	Q3'14
Product type	4
Bus type units	GT/s
Status	4
Processor core voltage	0.65?1.30
Launch date	2014-09-08T00:00:00
Processor cache	30720 KB
Memory
Memory channels supported by processor	Quad
ECC supported by processor	Yes
Maximum internal memory supported by processor	768 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	1600,1866,2133 MHz
Memory bandwidth supported by processor (max)	68 GB/s
Power
VID Voltage Range	0.65 - 1.3 V
Processor
Processor operating modes	64-bit
Processor model	E5-2680V3
Processor threads	24
Processor family	Intel Xeon E5 v3
Bus type	QPI
Box	No
FSB Parity	No
Stepping	M1
Processor frequency	2.5 GHz
Processor boost frequency	3.3 GHz
Processor cache	30 MB
L3 cache speed	2.5 GHz
Processor series	Intel Xeon E5-2600 v3
Component for	Server/Workstation
Number of QPI links	2
Processor cache type	Smart Cache, L3
Processor codename	Haswell
Processor lithography	28, 22 nm
Processor cores	12
System bus rate	9.6 GT/s
Processor socket	LGA 2011-v3
Other features
Cache memory	30 MB
Maximum internal memory	786432 MB
Intel	VT-d,VT-x
Operational conditions
Tcase	84.5
Processor special features
Intel	No
Intel Rapid Storage Technology	No
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Clear Video Technology	No
Intel Dual Display Capable Technology	No
Intel Secure Key Technology version	1.00
InTru? 3D Technology	No
Conflict Free processor	No
Intel FDI Technology	No
Intel Enhanced Halt State	Yes
Intel Trusted Execution Technology	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel Virtualization Technology for Directed I/O (	Yes
Intel Identity Protection Technology version	0.00
Intel Flex Memory Access	No
Intel TSX-NI	No
Intel Virtualization Technology (VT-x)	Yes
Intel Demand Based Switching	Yes
Intel 64	Yes
Intel Fast Memory Access	No
Intel TSX-NI version	0.00
Graphics
On-board graphics adapter	No

Device carrier made of galvanized, profiled sheet steel, surface coated with polyester resin. Tool-free fastening with design-integrated pressure locks ensure protection against theft and dismantling. Can be positioned variably in the support rail. Direct, extremely deep beam light distribution with shelf illumination using Individual.Lens.Optic made of PMMA plastic. The single lens optics ensure ease of installation and are easy to maintain thanks to the easy-to-clean surface. The rhythm of the 3-row single lens arrangement is perfectly coordinated within and across the device carrier and ensures a homogeneous appearance in the object. Electrical connection using a 1 m connecting cable for variable device carrier positioning in the light strip with a 5-pin quick-assembly plug with free phase preselection.