Features
CAS latency	40
Internal memory	32 GB
Memory layout (modules x size)	2 x 16 GB
Internal memory type	DDR5
Memory data transfer rate	5600 MT/s
Component for	PC
Memory form factor	288-pin DIMM
Memory channels	Dual-channel
Buffered memory type	Unregistered (unbuffered)
Memory ranking	1
Memory voltage	1.1,1.25,1.35 V
Module configuration	2048M x 64
Row cycle time	48 ns
Row active time	32 ns
Intel Extreme Memory Profile (XMP) version	3.0
Programming power voltage (VPP)	1.8 V
Product colour	Black
Cooling type	Heatsink
Lead plating	Gold
ECC
Intel Extreme Memory Profile (XMP)
SPD profile
JEDEC standard
Logistics data
Harmonized System (HS) code	84733020
Products per master (outer) case	25 pc(s)
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.75 kg
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Other features
Country of origin	China, Taiwan
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	101.72 g
Weight & dimensions
Width	6.62 mm
Depth	133.3 mm
Height	34.9 mm
Weight	68.28 g

Kingston FURY Beast 32 GB DDR5 memory (model KF556C40BBK2-32) is a dual-module memory kit for PC systems, consisting of two individual 16 GB DIMM modules. It serves as system memory for desktop computers and is specifically designed for systems requiring high data transfer rates and low latency. The module is based on DDR5 technology, which offers higher bandwidth and improved energy efficiency compared to DDR4. The total memory capacity is 32 GB, with each module providing 16 GB and configured in a 2048M x 64 layout. The memory data transfer rate is 5600 MT/s, enabling high speed for demanding applications such as gaming, 3D rendering, or 4K livestreaming. The CAS latency is 40, ensuring fast memory response time. The module is designed as unbuffered (unregistered) DIMM and supports dual-channel operation, thereby increasing overall system performance.

Applications
This module is primarily designed for PC systems, especially next-generation gaming platforms where high speed and stability are required. It is also suitable for professional applications such as 3D rendering, video editing, or livestreaming at high resolutions. Support for Intel® XMP 3.0 enables easy overclocking, with specifications defined in the SPD profile. The modules are intended for use in systems supporting DDR5 technology, particularly motherboards with Intel or AMD processors that utilize XMP or EXPO profiles.

Features and Specifications in Detail
The module features an integrated heatsink that improves heat dissipation and ensures stable operating temperature. The contact fingers are gold-plated, ensuring a reliable and long-lasting connection to the motherboard. The memory voltage is 1.25 V in XMP mode, with support for operating voltages of 1.1 V and 1.35 V. The modules are equipped with On-Die ECC (ODECC), which enhances data integrity at high clock speeds and improves system stability. The memory bank structure includes 32 banks, increasing parallel data processing. The Row Cycle Time is 48 ns, and the Row Active Time is 32 ns, contributing to fast access speed.

Technology Explained Simply
DDR5 technology offers higher bandwidth compared to DDR4 through doubling the burst length from 8 to 16 and doubling the number of banks from 16 to 32. This enables more efficient data processing and higher speeds. The integrated PMIC (Power Management IC) on the module ensures precise power delivery, enhancing stability at high clock speeds. Support for Intel® XMP 3.0 allows the use of pre-defined overclocking profiles, which are stored in the SPD profile. The module is designed for operating temperatures from 0 to 85 °C and can be stored at temperatures from -55 to 100 °C.

Compatibility and Accessories
The module is designed for PC systems with 288-pin DIMM sockets and is compatible with motherboards that support DDR5 memory. Support for Intel® XMP 3.0 enables the use of pre-defined overclocking profiles, with AMD EXPO profiles also supported. The modules are equipped with an SPD profile containing JEDEC standard settings (DDR5-4800 CL40-39-39 at 1.1 V) as well as XMP profiles (e.g., DDR5-5600 CL40-40-40 at 1.25 V). The modules are intended for use in systems requiring high memory capacity and speed.

Installation and Mounting
Installation is performed by inserting the two DIMM modules into the corresponding memory slots on the motherboard. The modules feature a 288-pin connector that fits into the DIMM sockets of the motherboard. The gold-plated contact fingers ensure a secure connection. The modules are designed for use in standard PC systems and require no special tools or additional components for installation. Mounting is done in the usual manner, inserting the modules into the slots and securing them with the retention clips.

Operational Advantages
The use of Kingston FURY Beast DDR5 memory provides high speed of 5600 MT/s with a CAS latency of 40, resulting in fast system response time. Support for Intel® XMP 3.0 enables easy overclocking, increasing system performance. The integrated cooling ensures stable operating temperature, enhancing reliability. The On-Die ECC function improves data integrity, especially at high clock speeds. The modules are suitable for demanding applications such as gaming, 3D rendering, or livestreaming and offer high efficiency through double the number of banks and burst lengths, as well as two independent 32-bit subchannels.