Features
CAS latency	16
Internal memory	32 GB
Memory layout (modules x size)	2 x 16 GB
Internal memory type	DDR4
Memory data transfer rate	3200 MT/s
Component for	PC
Memory form factor	288-pin DIMM
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Intel Extreme Memory Profile (XMP) version	2.0
Programming power voltage (VPP)	2.5 V
Cooling type	Heatsink
Lead plating	Gold
ECC
Intel Extreme Memory Profile (XMP)
Logistics data
Harmonized System (HS) code	84733020
Products per master (outer) case	25 pc(s)
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.63 kg
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Other features
Country of origin	China, Taiwan
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	96.69 g
Weight & dimensions
Width	7.2 mm
Depth	133.3 mm
Height	34.1 mm
Weight	68.34 g

The Kingston FURY Beast 32 GB DDR4 memory module (type KF432C16BBK2/32) is a 2-piece kit for PC systems, consisting of two individual modules each with 16 GB capacity. It serves as system memory for desktop computers and is primarily used in systems with Intel or AMD processors. The module is based on DDR4 technology and features a 288-pin DIMM form factor designed for standard PC motherboards. The 32 GB memory capacity enables efficient use in demanding applications such as gaming, video editing, or rendering.

Applications
This module is designed for systems requiring high bandwidth and fast data access times. It is particularly suitable for gaming PCs, multimedia workstations, and high-performance desktop systems. Support for Intel® Extreme Memory Profile (XMP) 2.0 allows for easy overclocking without manual BIOS settings, thereby enhancing system performance. Compatibility with AMD Ryzen systems is also explicitly mentioned, enabling use across a wide range of platforms.

Functions and Features in Detail
The module operates at a memory data transfer rate of 3200 MT/s, equivalent to DDR4-3200 speed. The CAS latency is 16, ensuring fast response times during data access. The standard memory voltage is 1.2 V, while XMP profiles require a voltage of 1.35 V. The modules are equipped with a low-profile heatsink that ensures efficient heat dissipation and allows for a slim form factor, fitting easily into standard PC cases. The contact fingers are gold-plated, ensuring a reliable and corrosion-resistant connection to the motherboard.

Technology Explained Simply
The memory architecture is based on a 2G x 64-bit layout per module, corresponding to a capacity of 16 GB. The internal structure includes 16 internal banks, organized into four groups of four banks each. The memory cells are equipped with an 8-bit pre-fetch, increasing data transfer rates. The burst length (BL) can be switched between BL8 and BC4 (Burst Chop), enabling flexible use across various applications. The Row Cycle Time is at least 45.75 ns, the Refresh Row Cycle Time is at least 350 ns, and the Row Active Time is at least 32 ns. These values are part of JEDEC standard specifications and ensure compatibility with standard PC systems.

Compatibility and Accessories
The module is designed for systems with Intel and AMD processors. Support for Intel® XMP 2.0 enables automatic overclocking to the specified speed of 3200 MT/s. The SPDs (Serial Presence Detect) are programmed with JEDEC standard latency (DDR4-2400, CL17-17-17 at 1.2 V), ensuring the module functions reliably in systems with standard settings. The XMP profiles offer additional speed tiers: Profile 1 (DDR4-3200 CL16-20-20 at 1.35 V) and Profile 2 (DDR4-3000 CL16-19-19 at 1.35 V). The modules are designed for use in desktop PCs and require no additional components for installation.

Installation and Mounting
Installation is performed by inserting the modules into the corresponding DIMM slots on the motherboard. The 288-pin configuration and gold-plated contacts ensure a secure connection. The low-profile design of the heatsink allows for mounting even in cases with limited space. The modules are designed for an operating temperature range of 0 to 85 °C and can be stored at temperatures from -55 to 100 °C. Installation requires no additional tools or components.

Advantages in Operation
The combination of high speed (3200 MT/s), low latency (CL16), and XMP 2.0 support enables optimal performance in demanding applications. The gold-plated contacts ensure a reliable connection, while the heatsink maintains stable temperatures under load. The module size of 16 GB per unit and the 2-piece kit allow for efficient use of memory resources in modern systems. The modules are 100% tested for speed, guaranteeing stable and reliable performance.