Features
CAS latency	16
Internal memory	32 GB
Memory layout (modules x size)	2 x 16 GB
Internal memory type	DDR4
Memory data transfer rate	3200 MT/s
Component for	PC
Memory form factor	288-pin DIMM
Memory voltage	1.2 V
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Intel Extreme Memory Profile (XMP) version	2.0
Programming power voltage (VPP)	2.5 V
Cooling type	Heatsink
Lead plating	Gold
ECC
Intel Extreme Memory Profile (XMP)
Logistics data
Harmonized System (HS) code	84733020
Products per master (outer) case	25 pc(s)
Master (outer) case width	203.2 mm
Master (outer) case length	311.1 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.63 kg
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Other features
Country of origin	China, Taiwan
Packaging data
Package width	95.2 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	96.69 g
Weight & dimensions
Width	7.2 mm
Depth	133.3 mm
Height	34.1 mm
Weight	69.52 g

The Kingston FURY Beast 32 GB DDR4 RAM (type KF432C16BB1K2/32) is a memory kit for desktop PCs, consisting of two modules each with 16 GB capacity. It serves as an upgrade for systems requiring higher memory speed and improved performance for multitasking, gaming, or content creation. The module is based on DDR4 technology and features a 288-pin DIMM form factor designed for standard PC motherboards. The total memory capacity is 32 GB, with each module having an internal configuration of 1024M x 64. The modules are equipped with a black heatsink that improves heat dissipation and supports stability under load.

Applications
This RAM kit is designed for use in modern desktop computers, particularly in systems based on Intel or AMD platforms. It is suitable for applications requiring high bandwidth and fast access times, such as gaming, video editing, 3D rendering, or demanding office applications. Support for Intel® Extreme Memory Profile (XMP) 2.0 allows for easy adoption of pre-configured high-performance parameters without requiring manual BIOS adjustments.

Features and Specifications in Detail
The modules operate at a standard memory data transfer rate of 3200 MT/s (PC4-25600) with a CAS latency of 16. The memory voltage is 1.35 V in XMP mode, while the JEDEC standard voltage is 1.2 V. The modules feature a gold-plated contact edge, ensuring a reliable electrical connection. The memory cells are configured in a 1G x 8-bit format, with each module consisting of sixteen FBGA components. The Row Cycle Time is at least 45.75 ns, the Refresh Row Cycle Time is at least 350 ns, and the Row Active Time is at least 32 ns.

Technology Explained Simply
DDR4 technology enables higher data rates and more efficient power supply compared to older memory standards. A CAS latency of 16 means the memory can access data in 16 clock cycles after a command, ensuring fast response times. Support for XMP 2.0 allows the modules to be set directly to pre-configured high-performance parameters without requiring manual BIOS settings. The heatsinks ensure the modules remain thermally stable even under heavy load, increasing reliability and lifespan.

Compatibility and Accessories
The module is compatible with systems using Intel and AMD platforms. Support for Intel XMP 2.0 enables easy setup at pre-configured high-performance parameters. The modules are not ECC-capable and therefore not suitable for server or critical applications requiring error correction. The specifications comply with JEDEC standard requirements, with SPDs (Serial Presence Detect) programmed with standard values for DDR4-2400 (CL17-17-17 at 1.2 V). The XMP profiles offer alternative settings: Profile #1 (DDR4-3200 CL16-18-18 at 1.35 V) and Profile #2 (DDR4-3000 CL15-17-17 at 1.35 V).

Installation and Mounting
Installation involves inserting the two 288-pin DIMM modules into the corresponding memory slots on the motherboard. The modules feature a flat, black heatsink that improves heat dissipation. After physical installation, the XMP function must be activated in the BIOS to utilize the full performance parameters. The modules are designed for operation in a temperature range of 0 to 85 °C, with storage temperatures allowed between -55 and 100 °C.

Operational Advantages
The combination of high memory bandwidth, low latency, and efficient cooling ensures stable and high-performance system operation. XMP support enables quick and secure setup without manual adjustments. The modules are 100 % speed-tested, ensuring reliable performance under load. The use of gold-plated contacts increases the longevity and reliability of the connection.