| Design |
| Product colour | Silver |
| Other features |
| Dimensions (WxDxH) | 15 x 15 x 5 mm |
| Performance |
| Type | Heatsink |
| Quantity per pack | 8 pc(s) |
| Technical data |
| Width packaging | 0.085m |
| Type | IC cooler |
| Dimensions (LxWxH) | 14x14x6mm |
| Length packaging | 0.130m |
| Article length | 1.50cm |
| Net weight | 0.012kg |
| Weight | 0.025kg |
| Height packaging | 0.020m |
| Article width | 1.50cm |
| Packaging volume | 0.0002m³ |
| Article height | 0.50cm |
| Weight & dimensions |
| Width | 15 mm |
| Depth | 15 mm |
| Height | 5 mm |
| Weight | 12 g |
| Package width | 85 mm |
| Package depth | 130 mm |
| Package height | 20 mm |
| Package volume | 200 cm³ |
| Package weight | 25 g |
Tool-free passive cooling for small ICs in an 8-packTool-free mounting: Self-adhesive thermal pads enable quick, clean hold on the component.
Heat dissipation in confined spaces: Compact 14 x 14 x 6 mm cooling fins reduce heat buildup on small IC packages.
Flexible retrofit during operation: Retrofit cooling directly without drilling or brackets.
Cover multiple applications: 8 pieces per pack facilitate series work and service deployments.
The self-adhesive heat sinks simplify retrofitting passive cooling on small IC chips. Pre-applied thermal pads enable quick, tool-free mounting; the compact design supports the dissipation of heat and helps protect components from overheating.
In professional IT environments, during on-site installations and in service deployments, components in existing infrastructures can be retrofitted or replaced quickly. The 8-piece set provides reserves for repairs, small series and tests when multiple components are equipped in parallel.
Dimensions: 14 x 14 x 6 mm
Quantity: 8 pieces
Color: Silver
Mounting: self-adhesive thermal pads
Type: passive heat sink
Form factor: cooling fins
Application: small IC chips