| Design |
| Product colour | Blue |
| Technical data |
| Type | RAM cooler |
| Packaging volume | 0.0003m³ |
| Weight | 0.031kg |
| Length packaging | 0.185m |
| Net weight | 0.015kg |
| Height packaging | 0.025m |
| Width packaging | 0.070m |
| Dimensions (LxWxH) | 22x20x5mm |
| Weight & dimensions |
| Weight | 15 g |
| Package width | 70 mm |
| Package depth | 185 mm |
| Package height | 25 mm |
| Package volume | 300 cm³ |
| Package weight | 31 g |
Efficient RAM cooling with no mounting requiredFast retrofit without screws: Pre-mounted thermal pads for tool-free attachment on RAM components.
Targeted heat dissipation at hotspots: Heat sink fins improve temperature distribution on individual memory chips.
Compact format: 22 x 20 x 5 mm for tight spaces on modules and in enclosures.
Practical set of 4: Four heat sinks for multiple components or as spares.
Clean look: Blue version for clear identification on the board.
The self-adhesive heat sink fins dissipate heat from memory components and support reliable operation even under high load. Thanks to pre-mounted thermal pads, the heat sinks can be attached quickly and cleanly to individual RAM chips, with no screws or clips. The compact format enables retrofitting even in tight enclosures.
In professional IT environments, during on-site upgrades and service deployments, modules can be retrofitted quickly without altering the existing infrastructure. The heat sink fins integrate into systems of companies and public institutions and help to increase thermal headroom in a targeted manner.
Type: Passive heat sink for memory components
Dimensions: 22 x 20 x 5 mm
Mounting: Self-adhesive thermal pads
Quantity: 4 pieces
Color: Blue