| Features |
| Product colour | Multicolour |
| Packaging data |
| Package width | 65 mm |
| Package depth | 105 mm |
| Package height | 20 mm |
| Package volume | 100 cm³ |
| Package weight | 12 g |
| Technical data |
| Quantity | 0.5g |
| Net weight | 0.034kg |
| Height packaging | 0.020m |
| Article height | 1.20cm |
| Packaging volume | 0.0001m³ |
| Article length | 5.50cm |
| Article width | 2.00cm |
| Width packaging | 0.065m |
| Length packaging | 0.105m |
| Weight | 0.012kg |
| Weight & dimensions |
| Width | 20 mm |
| Depth | 55 mm |
| Height | 12 mm |
| Weight | 34 g |
Precise application and reliable thermal conductionUniform application: Spatula facilitates precise spreading on the contact surface.
Efficient heat transfer: Thermal conductivity >1.729 W/m-K supports coupling between component and heat sink.
Temperature-stable in operation: -50-240 °C for consistently reliable performance.
Needs-based amount: 0.5 g for metered application during assembly and service.
The white thermal paste supports effective heat transfer between electronic components and heat sinks. With the included spatula, it can be spread thinly and evenly so that the contact surface is optimally utilized.
It proves itself in professional IT environments, in on-site installations, and in service deployments within existing infrastructures of companies and public institutions.
Color: White
Thermal conductivity: >1.729 W/m-K
Thermal resistance: 0.125 °C-in²/W
Operating temperature: -50-240 °C
Content: 0.5 g
Ingredients: Silicone 50 %, carbon 30 %, metal oxides 20 %
Accessories: Spatula