Features
Thermal conductivity	5.6 W/m·K
Density	3.96 g/cm³
Product colour	White
Viscosity note	850
Non-capacitive
Non-corrosive
Non-curing
Non-conductive
Non-bleeding
Packaging data
Package width	82 mm
Package depth	15 mm
Package height	165 mm
Package weight	22 g
Package type	Blister
Technical details
Compliance certificates	RoHS
Low thermal resistance
Weight & dimensions
Weight	8 g

MX-2 is a high thermal conductivity and low thermal resistance compound for components that require optimum thermal dissipation. It is ideally suited for use in CPU, GPU cooling and other applications between power semiconductor components and heat sinks where thermal conductivity is a major factor.