General
Socket	SP3
Clock frequency	3.0 GHz
Turbo clock frequency	3.3 GHz
Number of cores	16
Number of threads	32
Cache	128 MB
TDP	155 W
Architecture	Rome
Processor family	EPYC
Model	7302P
Type of delivery	Tray

The item is a processor from the AMD EPYC 7302P series, specifically designed for server and high-performance computing applications. It is based on the Rome architecture and operates in the SP3 socket. With 16 physical cores and 32 logical threads, it offers high parallel processing capacity, suitable for demanding server applications, virtualization, and data processing. The base clock speed is 3.0 GHz, with the turbo mode reaching up to 3.3 GHz. The processor features an integrated memory controller and supports DDR4-SDRAM with maximum bandwidth optimized for server environments. The delivery format is Tray, meaning without housing, which is typical for use in rack servers.

Applications

The processor is intended for use in enterprise servers, data centers, and high-performance computers. It is particularly suitable for applications requiring high computing power and parallel processing, such as virtualization environments, database servers, cloud infrastructures, and big data analytics. The SP3 socket compatibility enables integration into server platforms based on AMD’s EPYC platform.

Functions and Features in Detail

The EPYC 7302P features a 128-MB integrated cache, which reduces access times for frequently used data and improves overall system performance. The 16 physical cores enable simultaneous execution of multiple processes, with each core capable of processing two threads in parallel (SMT technology). The integrated memory controller technology supports multiple DDR4-SDRAM channels, resulting in high memory bandwidth. The processor performance is limited by a thermal design power (TDP) of 155 W, which requires appropriate cooling and power supply design within the server system.

Technology Explained Simply

The clock speed of 3.0 GHz describes the rate at which the processor executes instructions. In turbo mode, the frequency can increase up to 3.3 GHz, provided thermal and power conditions allow. The 128-MB cache serves as a fast intermediate storage for frequently accessed data, minimizing access delays. The SP3 socket platform is specifically developed for servers and supports multiple processors in a single system, which is important for high-availability solutions. The TDP of 155 W is a measure of the maximum heat output that the cooling module in the server must dissipate.

The processor architecture is based on the Rome generation, developed by AMD for servers. The support for DDR4-SDRAM enables high memory bandwidth, which is critical for processing large data volumes. The 16 cores and 32 threads provide high parallel processing capacity, which is required for modern server applications.

Compatibility and Accessories

The processor is designed for server platforms with SP3 socket. It is compatible with server motherboards supporting this socket and can be used in systems with multiple processors. Its use requires appropriate cooling capable of dissipating the TDP of 155 W, as well as a power supply meeting the performance requirements.

Installation and Mounting

Installation is performed in server enclosures with SP3 socket. The processor is inserted into the socket, ensuring correct alignment (usually indicated by a notch or marking). After insertion, the processor is connected to a heatsink to dissipate heat. The exact mounting instructions depend on the specific server model and are detailed in the server manufacturer’s manual.

Advantages in Operation

The processor provides high computing performance and parallel processing, essential for modern server applications. The integrated memory controller technology reduces latencies and increases system efficiency. Support for multiple processors in a single system enables high-availability and load-balancing solutions. The TDP of 155 W is standard for server environments and does not require special cooling measures if system requirements are met. Use in rack servers is standardized by the Tray delivery format.